LogiMAT 2024

TELOGS GmbH looks back on an extremely successful trade fair appearance at LogiMAT 2024 in Stuttgart. The company, which specializes in technical services for logistics systems, was able to welcome numerous visitors to its stand in Hall 1, Booth 1C15, during the trade fair. The focus of interest was on the topics of service and retrofit for stacker cranes and conveyor technology — areas that continue to gain in importance in modern logistics.

LogiMAT, which is regarded as the world's leading trade fair for intralogistics solutions and process management, once again offered an ideal platform for discussing the latest developments and challenges in the industry. This year, the trade fair once again attracted thousands of trade visitors from all over the world who wanted to find out about innovative products and services.

The TELOGS GmbH team — consisting of Dzenita Radzo, Marc Punzert, Tim Meinke, Jürgen Dönges and Sascha Troge — answered questions from visitors during the trade fair. There was particularly great interest in the tailor-made service and retrofit solutions that TELOGS offers for existing logistics facilities. These solutions enable companies to make their existing systems more efficient and significantly extend their lifespan without having to invest in new equipment.

A special highlight during the trade fair was the exclusive wine tasting at the TELOGS stand, which took place on the second day of the fair between 4 and 6 pm. Many visitors took the opportunity to have further discussions and expand their network in a relaxed atmosphere.

TELOGS would like to thank all visitors and the entire team for their successful appearance at LogiMAT 2024. Special thanks also goes to Constanze Peterseim, who captured the lively atmosphere at the stand in great pictures.

With many new contacts and valuable discussions, TELOGS GmbH is already looking forward to the next LogiMAT and to continuing to impress as a reliable partner in the area of technical services for logistics systems in the future.

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